Imec and EV Group push hybrid bonding toward denser memory-to-logic stacks

The announcement points to continuing investment in hybrid bonding as a manufacturing path for denser chip assemblies. According to the source item, the work targets advanced logic-to-logic and memory-to-logic stacking and demonstrated a 200 nm interconnect pitch with high overlay accuracy. For the memory market, the relevance is mostly strategic: tighter bonding could support future packaging approaches where memory sits closer to logic, but the item does not indicate near-term changes in DRAM, NAND, HBM, or SSD supply or contract pricing.