ASE panel-level packaging line targets AI and HBM integration

ASE is moving advanced packaging toward larger rectangular panels with an automated 310mm by 310mm panel-level packaging production line. EE Times Asia reports that the platform is compatible with FOCoS and FOCoS-Bridge and is intended to improve throughput, usable area, cycle time, and material efficiency versus wafer-level approaches. The RamTrend angle is HBM integration. The source frames the packaging shift around heterogeneous integration, where chiplets, ASICs, and high-bandwidth memory need dense, low-latency interconnects. As AI accelerator packages grow larger and more complex, panel-level packaging could become one way to scale multi-die systems that include HBM stacks. This is not a near-term HBM pricing update. Production is expected in the first half of 2027, and the payload does not name specific memory customers or volumes. It is still a useful supply-chain signal for AI packaging capacity and the manufacturing path around HBM-heavy systems.