GUC is showcasing VSORA's Jotunn8 inference processor as a data-center AI chip built with advanced packaging and HBM3E integration. The design combines chiplet architecture, die-to-die connectivity, and TSMC CoWoS-S packaging to address the memory-wall problem in large-scale AI inference. For RamTrend, this is another sign that HBM demand is not limited to the largest training accelerators. If inference ASICs increasingly pair custom compute with HBM3E, the buyer base for high-bandwidth memory can broaden across more AI hardware programs. The article does not disclose production volume, so the price impact remains directional.
HBM · May 26, 2026
Jotunn8 AI processor highlights HBM3E in inference ASIC design
GUC and VSORA's Jotunn8 AI inference processor uses HBM3E integration and advanced packaging, showing how inference ASICs are also leaning on high-bandwidth memory.
Price impact: 3Direction: upSource: EE Times Asia
Global UnichipVSORATSMCHBM3EHBM3CoWoS-SAI inference processors
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